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¡¡Microwave dielectric printed-circuit substrates with perfect electrical performance characteristics and better mechanical strength are made from straight PTFE sheets and woven-glass PTFE laminate sheets with single-sided and double-sided copper-clad substrates or copper-clad and cloudlet-sided copper-clad substrates or copper-clad on one side of the substrate and aluminum-clad(copper)on the other side of it by way of high-temperatuer,baking and sintering processes.
Teflon woven glass fabric copper-clad laminates£¨F4B-1/2£©
Teflon woven glass fabric copper-clad laminates with high permittivity £¨F4BK-1/2£©
Teflon woven glass fabric copper-clad laminates with high permittivity£¨F4BM-1/2£©
Teflon woven glass fabric copper-clad laminates with high permittivity£¨F4BMX-1/2£©
Teflon woven glass fabric copper-clad laminates with high permittivity£¨F4BME-1/2£©
Teflon woven glass fabric copper-clad laminates with high permittivity (F4BDZ294)
Metallic Teflon woven glass fabric copper-clad laminates £¨F4B-1/AL.CU£©
Insulative Teflon woven glass fabric copper-clad laminates£¨F4T-1/2£©
Teflon woven glass fabric
 
¡¡The microwave composite-dielectric copper-clad substrate is made up of the composition of the low loss mineral titanic(TiO2) and low loss organic plastic in proportion achieved by way of baking,sintering and press processes,on which then super thin copper foils being clad by pressing process.This makes the substrates the best ones for microwave components,devvices and printed-circuit device in satellite communications,navigation,solid-state phase-array radars,broadcasting and Television fields.
Microwave dielectric copper-clad substrate£¨TP-1/2£©
Teflon ceramic dielectric copper-clad substrate£¨TF-1/2£©