| This
substrate of good quality is widely and specially
used to microware printed-circuits.It is made
from import highly rated materials and completed
through high-temperature,high-pressure,baking
and sintering processes according To the electrical
requirements of a microwave circuit. |
| ※Technical
Specifications: |
| 1、Exterior
Looks:In conformity to the exterior looks,performances
of microwave printed-circuit substrate materials
specified by both the National and Milirary Standards. |
| 2、Normal
Dimensions(mm):840×840；600×500；500×500；500×430；380×350；300×250 |
| 3、Thickness
of Copper-clad(mm):0.035 or 0.018 |
| 4、Thickness
and Tolerance: |
|
a. The normal thickness of copper-clad includes
that of the copper sheets on both sides of the
substrates. |
|
b. Thickness and Tolerance |
| Thickness(mm) |
0.17,0.25 |
0.5,0.8,1.0 |
1.5,2.0 |
3.0,4.0,5.0 |
| Tolerance(mm) |
±0.01 |
±0.03 |
±0.05 |
±0.06 |
|
|
c. Specified dimensions can be assigned according
to the requirements of customers' circuit design. |
| 5、Metamucil
Properties: |
|
a. Flexibility Factory: |
|
Thickness(mm) |
Maxi
am Flexibility Factor(mm/mm) |
| Laminate
Board
With smooth Surfaace |
Single-sided
Copper-clad |
Double-sided
Copper-clad |
| 0.25-0.5 |
0.03 |
0.05 |
0.025 |
| 0.8-1.0 |
0.025 |
0.03 |
0.020 |
| 1.5-2.0 |
0.020 |
0.025 |
0.015 |
| 3.0-5.0 |
0.015 |
0.020 |
0.010 |
|
|
b. Shearing and punching Properties: |
| Shearing:
＜1mm thickness without burrs after shearing,
the minimum separation between two holes punched
being 0.55without peeling off. |
| ≥1mm
thickness without burrs after，the minimum separation
between two holes punched being 1.10 without peeling
off. |
c.Copper Peel Strength: ≥15N/cm(in normal condition).
≥12N/cm（being Kept in constant damp and hot
and 260℃±2℃ solder conditions for 20seconds
without blisters and peeling off）
|
|
d.Chemical Properties:Printed-circuits made by
photo-fabrication with the performance of the
dielectric materials of the substrate unchanged
and moralizing holes process ability. |
|
e.Physical and Electrical Properties:See"Table
of Performance"Characteristics of Main Substrates
affianced. |
