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Tel£º0523-86921512£¬86928698
Fax£º0523-86921544
Address£ºTaizhou City, Jiangsu Province High-Port Wing Qianzhou Town Mabune Road No. 8
P.C.£º225327
E-mail£ºzhudeming20339@sina.com
wangling@wang-ling.com
http://www.wang-ling.com.cn |
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Teflon woven glass fabric copper-clad laminates F4B-1/2 |
This product is formulated with excellent material according to the requirements of microwave circuit in electrical performance. It is a kind of excellent microwave PCB baseplate due to its excellent electrical performance and higher mechanical strength.
Technical Specifications
Appearance |
Meet the specification requirements for microwave PCB baseplate
specified in National and Military Standards. |
Dimensions£¨mm£© |
300¡Á250 |
380¡Á350 |
440¡Á550 |
500¡Á500 |
460¡Á610 |
600¡Á500 |
840¡Á840 |
1200¡Á1000 |
1500¡Á1000 |
|
For special dimensions, customized lamination is available. |
Copper thickness |
0.035mm 0.018mm |
Thickness and tolerance£¨mm£© |
Plate thickness |
0.17,0.25 |
0.5,0.8,1.0 |
1.5,2.0 |
3.0,4.0,5.0 |
Tolerance |
¡À0.01 |
¡À0.03 |
¡À0.05 |
¡À0.06 |
Plate thickness includes the copper thickness. For special dimensions,
customized lamination is available. |
Mechanical properties |
Angularity |
Plate thickness£¨mm£© |
Maximum angularity mm/mm |
Original board |
Single-sided board |
Double-sided board |
0.25¡«0.5 |
0.03 |
0.05 |
0.025 |
0.8¡«1.0 |
0.025 |
0.03 |
0.020 |
1.5¡«2.0 |
0.020 |
0.025 |
0.015 |
3.0¡«5.0 |
0.015 |
0.020 |
0.010 |
Cutting/ punching property |
For the plate of£¼1mm, no burrs after cutting, minimum space between two punching holes is 0.55mm, no separation.
For the plate of¡Ý1mm, no burrs after cutting, minimum space between two punching holes is 1.10mm, no separation. |
Peel strength |
In normal state:¡Ý15N/cm; No bubbling, no separation and peel strength ¡Ý12 N/cm when in the environment of constant humidity and temperature and kept in the melting solder of 260¡æ¡À2¡æ for 20 seconds. |
Chemical properties |
According to different properties of baseplates, the chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed and the holes can be metallized. |
Electrical properties |
Names |
Test conditions |
Unit |
Specifications |
Gravity |
Normal state |
g/cm3 |
2.2¡«2.3 |
Water absorption rate |
Dip in distilled water of 20¡À2¡æ for 24 hours. |
% |
¡Ü0.02 |
Operating temperature |
high-low temperature chamber |
¡æ |
-50¡«+260 |
Thermal conductivity coefficient |
|
Kcal /m .h.¡æ |
0.8 |
Coefficient of thermal expansion |
Temperature rise of 96¡æ per hour |
Coefficient of thermal expansion¡Á1 |
¡Ü5¡Á10-5 |
Shrinkage factor |
Two hours in boiling water |
% |
0.0002 |
Surface insulation resistance |
500V DC |
Normal state |
M.¦¸ |
¡Ý5¡Á103 |
Constant humidity and temperature |
¡Ý5¡Á102 |
volume resistance |
Normal state |
M¦¸.cm |
¡Ý5¡Á105 |
Constant humidity and temperature |
¡Ý5¡Á104 |
Pin resistance |
500VDC |
Normal state |
M¦¸ |
¡Ý5¡Á104 |
Constant humidity and temperature |
¡Ý5¡Á102 |
Surface dielectric strength |
Normal state |
¦Ä=1mm(kV/mm) |
¡Ý1.2 |
Constant humidity and temperature |
¡Ý1.1 |
Permittivity |
10GHZ |
¦År |
2.55
2.65 £¨¡À2%£© |
Dielectric loss angle tangent |
10GHZ |
tg¦Ä |
¡Ü1¡Á10-3 |
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