| The
high polymer magnetic microwave composite-dielectric
substrate is made up of the composition
of low loss minerals,high polymer magnetic
materials and organic plaits in proper
proportion.Then a copper-clad substrate
is achieved by way of baking,sintering
and press process,on which super thin
copper foils being pressed finally.It
is used widely for mobile communications,micro
strip antennas,circulators,isolators as
well as others microwave devices.This
type of substrate is the first of it's
kind in China and in the lead worldwide. |
| 1.Micros
trip Circuit Features by use of the Substrate: |
| (1)
The adhesive strength between copper foil
and dielectric is higher than that of
the vacuum coating on ferrite substrate,being
easy of circuit fabrication with high
output rate of end products and much lower
cost than that of ferrite one. |
| (2)
Easy machine-shaping by drilling-machine,lathe,milling-machine,shearer
and photo fabrication.There is no comparison
of fabrication processes between the substrate
descirbed above and ceramic one. |
| 2.Technical
Specifications: |
| (1)
Exterior Looks:Well plane ness on both
sides of the substrate sceatches,hollows,copper
without foil stains folded and pinholes. |
| (2)
Dimensions(mm):120×100，135×135，150×150， |
| (3)
Dimensions and Tolerance(mm):0.8±0.03
1±0.04 2±0.06 |
| (4)
Mechanical Properties: |
a.
Copper Peel Strength:≥10N/cm (in normal
condition).
8N/cm (in alter mating damp and hot condition).
|
| b.Tensile
Strength:≥800Kg/cm2 |
| (5)
Chemical Properties:Printed-circuits made
by photo-fabrication with the performances
of the dielectric materials of the substrate
unchanged. |
| (6)
Physical and Electrical Properties: |
