Tel£º0523-86921512£¬86928698
Fax£º0523-86921544
Address£ºTaizhou City, Jiangsu Province High-Port Wing Qianzhou Town Mabune Road No. 8
P.C.£º225327
E-mail£ºzhudeming20339@sina.com
wangling@wang-ling.com
http://www.wang-ling.com.cn
 
 
Teflon ceramic dielectric substrate TF-1/2

    This product is made by Teflon resin (with excellent microwave and temperature resistance performance) and natural minerals. This kind of material can be comparable with the products (such as RT/duroid  6006\6010\TMM10) from Rogers Corporation in United state of America.
Main features of the material:
(1) The operating temperature is much higher than TP series. It is applicable to long-term operation within the temperature range of -80¡æ¡«+200¡æ, and can be used for wave-welding and melt-back welding.
(2) Used for the processing of microwave and millimeter wave printing circuits.
(3) Better radiation performance£¬30min20rad/cm2.
(4) The permittivity is stable and has a slight variation with the rise of temperature and frequency.
Permittivity£º¦År£½3.0£»6.0£»9.2£»9.6£»10.2.

Technical Specifications


Appearance

Smooth and neat on both sides; no stain, scar and sunken.

Dimensions

150¡Á150   250¡Á250   200¡Á310

Thickness and tolerance are same as that for TP series. It is optional by the customer for special dimensions.

Mechanical properties

Peel strength

¡Ý8N/cm

Angularity

Same as that for TP series.

Cutting/ punching property

 

No burrs after cutting, and the minimum space between two punching holes is 0.55mm.

Chemical properties

According to different properties of baseplates, the chemical etching method for PCB can be used for the circuit processing, the dielectric properties of materials are not changed and the holes can be metallized.

Electrical   properties

Names

Test conditions

Unit

Specifications

Gravity

Normal state

g/cm3

3

Water absorption rate

Dip in distilled water of 20¡À2¡æ for 24 hours.

%

¡Ü0.02

Operating temperature

high-low temperature chamber

¡æ

-80¡«+260

Thermal conductivity coefficient

 

Kcal /m .h.¡æ

0.5

Coefficient of thermal expansion

Temperature rise of 96¡æ per hour

Coefficient of thermal expansion¡Á1

¡Ü1¡Á10-5

Shrinkage factor

Two hours in boiling water

%

0.0001

Surface insulation resistance

500V DC

Normal state

M.¦¸

¡Ý1¡Á105

Constant humidity and temperature

¡Ý1¡Á103

volume resistance

Normal state

M¦¸.cm

¡Ý1¡Á105

Constant humidity and temperature

¡Ý1¡Á104

Pin resistance

500V DC

Normal state

M¦¸

¡Ý1¡Á106

Constant humidity and temperature

¡Ý1¡Á104

Surface dielectric strength

Normal state

¦Ä=1mm(kV/mm)

¡Ý1.6

Constant humidity and temperature

¡Ý1.4

Permittivity

10GHZ

¦År

2.        3
6£¨¡À2%£©
9.2
9.6
10.2

Dielectric loss angle tangent

10GHZ

tg¦Ä

¡Ü1¡Á10-3