| This product is made from E-grade
woven-glass and TPFE resin with scientific compound
by way of strict press processes.It is dielectric
constant goes on over a wide range. |
| ※Technical
Specifications: |
| 1、Exterior
Looks:In conformity to the exterior looks,performances
of microwave printed-circuit substrate materials
specified by both the National and Milirary Standards. |
| 2、Types：F4BK225,F4BK265
and F4BK350 where 225,265 and 350 indicate the
dielectric constants2.25,2.65 and 3.50 respectively. |
| 3、Dimensions(mm):300×250、350×380、500×500、600×500、840×840 |
| 4、Thickness
and Tolerance: |
| Thickness(mm):0.25，0.5，0.8，1.0
Tolerance(mm):±0.02～±0.04 |
| Thickness(mm):1.5，2.0，3.0，4.0，5.0
Tolerance(mm):±0.05～±0.07 |
| 5、Mechanical
Properties |
|
a. Flexibility Factory: |
|
Thickness(mm) |
Maxi
am Flexibility Factor(mm/mm) |
| Laminate
Board
With smooth Surfaace |
Single-sided
Copper-clad |
Double-sided
Copper-clad |
| 0.25-0.5 |
0.03 |
0.05 |
0.025 |
| 0.8-1.0 |
0.025 |
0.03 |
0.020 |
| 1.5-2.0 |
0.020 |
0.025 |
0.015 |
| 3.0-5.0 |
0.015 |
0.020 |
0.010 |
|
|
b. Shearing and punching Properties: |
| Shearing:
＜1mm thickness without burrs after shearing, the
minimum separation between two holes punched being
0.55without peeling off. |
| ≥1mm
thickness without burrs after，the minimum separation
between two holes punched being 1.10 without peeling
off. |
c.Copper Peel Strength: ≥15N/cm(in normal condition).
≥12N/cm（being Kept in constant damp and hot and
260℃±2℃ solder conditions for 20seconds without
blisters and peeling off）
|
|
d.Chemical Properties:Printed-circuits made by
photo-fabrication with the performance of the
dielectric materials of the substrate unchanged
and moralizing holes process ability. |
|
e.Physical and Electrical Properties: |
