| This
product is made from import woven-glass of fine
fiber with high purity and high homogeneous degree
of thickness and impost super thin copper foils,
completed through the teehnological processes
as same as that for woven-glass TPEF laminate
substrates.This makes it ideal for microwave and
millimeter wave circuit applications with the
circuits made of super fine line width and gaps. |
| ※Technical
Specifications: |
| 1、Mehanical
Properties and Electrical Specifications: |
|
a. Flexibility Factory: |
|
Thickness(mm) |
Maxi
am Flexibility Factor(mm/mm) |
| Laminate
Board
With smooth Surfaace |
Single-sided
Copper-clad |
Double-sided
Copper-clad |
| 0.25-0.5 |
0.03 |
0.05 |
0.025 |
| 0.8-1.0 |
0.025 |
0.03 |
0.020 |
| 1.5-2.0 |
0.020 |
0.025 |
0.015 |
| 3.0-5.0 |
0.015 |
0.020 |
0.010 |
|
|
b. Shearing and punching Properties: |
| Shearing:
＜1mm thickness without burrs after shearing,
the minimum separation between two holes punched
being 0.55without peeling off. |
| ≥1mm
thickness without burrs after，the minimum separation
between two holes punched being 1.10 without peeling
off. |
c.Copper Peel Strength: ≥15N/cm(in normal condition).
≥12N/cm（being Kept in constant damp and hot
and 260℃±2℃ solder conditions for 20seconds
without blisters and peeling off） |
|
d.Chemical Properties:Printed-circuits made by
photo-fabrication with the performance of the
dielectric materials of the substrate unchanged
and moralizing holes process ability. |
|
e.Physical and Electrical Properties:See"Table
of Performance"Characteristics of Main Substrates
affianced. |
| Number |
Item |
Test
Condition |
Unit |
Target
value |
| 1 |
Gravity |
In
normal |
g/㎝² |
2.2～2.3 |
| 2 |
Water
Absorption |
Soaking
in Distilled water of20±2℃ for 24 hours. |
% |
≤0.02 |
| 3 |
Operating
Temperature |
High
AND Low Temperature Oven |
℃ |
-50～+260 |
| 4 |
Heat
Conduction Coefficient |
|
Kcal/m.hour℃ |
0.8 |
| 5 |
Linear
Expansion Coefficient |
Arise
of 96℃ in Temperature/hour |
×1 |
≤5×10-5 |
| 6 |
Shrinkage |
To
be boiled in Boiling water for 2 hors. |
% |
0.0002 |
|
7 |
Surface
Insulation Resistance |
500V
direct current |
normal |
M.Ω |
≥1×10-4 |
| const
damp and hot |
≥1×10-3 |
|
8 |
Bulk
Resistance |
In
normal conditio |
MΩ.cm |
≥1×10-6 |
| const
damp and hot |
≥1×10-5 |
|
9 |
Resistance
Between Plugs |
500V
direct current |
In
normal conditio |
MΩ |
≥1×10-5 |
In
constant damp condition |
≥1×10-3 |
|
10 |
Surface
Electric Strength |
In
normal conditio |
δ=1mm(kv/mm) |
≥1.2 |
| In
constant damp condition |
≥1.1 |
| 11 |
Dielectric
Constant |
10GHz |
εr |
|
| 12 |
Dielectric
Constant Tangent |
10GHz |
tgδ |
≤1×10-3 |
|
| 2、Special
Properties: |
|
a. High accuracy of fine line width of printed-Circes
made from the substrate because of the adoption
of mport super thin copper foils. |
|
b. Higher homogeneous degree of copper foil thickness
makes the circuit performances ideal for a good
design effect. |
|
c. The copper peel strength has been increased
further. |
| 3、Rhickness
of Copper-clad Substrates:It varies from 0.07mm
to 0.25mm according to the circuit design desired
by customers. |
