| 1、
Microwave Circuit Feature by the use
of the Substrates: |
| （1）Dieletric
Constant:Ranging from 3 to 16 with long-term
stability and operating temperature from-100℃+0+150℃
at designers' choice. |
| （2）The
adhesive strength between copper foil
and dielectric material is higher than
that of vacuum coating on ceramic substrate,being
easy of circuit fabrication with high
output rate of end products and much lower
cost than those of ceramic ones. |
| （3）Dielectric
Constant Tangent(tgδ):≤10ˉ3(Dielectric
loss decreases with the increase of fabrication
processes between the substrates decreases
with the increase of frequency). |
| （4）Easy
machine-shaping by drilling-machine,lathe,milling-machine,shearer
and photo-fabrication.Thus,there is no
comparison processes between the substrates
described above and ceramic ones. |
| 2、
Technical specification: |
| （1）
Outward appearance: Two-sided smooth,
does not have the spot, the scar, is hollow
and so on. |
| （2）
Dimensions and Tolerance: |
| a)
Dimensions:A×B（mm）：50×30，80×40，120×80；
A(B)Tolerance ≤±0.03 120×100，150×150，220×160；A(B)Tolerance≤±0.05 |
| b)
Thickness and Tolerance:δ（mm）0.8±0.03；1±0.04；1.2±0.05
1.5±0.06；2±0.08 |
| （3）
Mechanical Properties: |
| a.
Copper Peel Strength:≥6N/cm(in normal
condition). ≥4N/cm(in alternatively damp
and hot condition). |
| b.
Chemical Properties:Printed-circuits made
by photo-fabrication with the performances
of the dielectric materials of the substrate
unchanged. |
| （4）
Physics electrical specification. Bears
the solder dip: 30W; Constant temperature
iron 200 ℃ 20 seconds. Physics electrical
specification sees the table: |
