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Tel:0523-86921512 85656880
Fax:0523-86921544
Address:2 Mach an Road(west),Yongan Town.
Taizhou,Jiangsu Province,China.
P.C.:225327
E-mail:wangling@wang-ling.com.cn
http://www.wang-ling.com.cn
 
 
TF-1/2 PTFE-Ceramic Composite-dielectric Substrate
  The product is compounded by PTFE resin materials of good microwave 1 features and heat-resisting,and natural minerals. Tt's performed ace characteristics can be compared favorably with those4 of RT/devoid 6006,6010 and TM10 of Rogers Corp USA.Customers can equate one with other.
 This material main characteristic:
  1.Range of Operating Temperature:From -80℃ to +260℃
(A little rise move than that of TP Series products,suitable for wave-crest soldering and melt-back soldering and melt-back soldering-Inter.national Standard being 260℃,40seconds).
  2.Being of great use for the fabrication of microwave and millimeter wave circuits.
  3.Radiation Receptivity:30min 20rad/cm2
  4、Stable Dielectric Constant(εr):3,6,9.2,9.6 and 10.2(A decrease with the increase of temperature and frequency).
 Technical Specifications:
  1.Exterior Looks:As same as those of TP Series products.
  2.Dimensions:Thickness and tolerance as same those of TP Series products.
  3.Mechanical Properties:

  a. Tensile Strength:≥15N/cm   
  b. Flexibility Factor:As same as that of TP series products.
  c. Shearing and Punching Properties:Without burrs after shearing and the minimum separation between two holes punched being 0.55mm.

  4、Chemical Properties:
  a. Printed-circuits made by photo-fabrication with the performances of the dielectric materials of the substrate unchanged.
  b. With moralizing holes process ability.
  5、 Physical and Electrical Properties:
Number
Item
Test Condition
Unit
Target value
1
Gravity
In normal
g/㎝²
3
2
Water Absorption
Soaking in Distilled water of20±2℃ for 24 hours.
%
≤0.02
3
Operating Temperature
High AND Low Temperature Oven
-80~+260
4
Heat Conduction Coefficient
Kcal/m.hour℃
0.5
5
Linear Expansion Coefficient
Arise of 96℃ in Temperature/hour
×1
≤1×10-5
6
Shrinkage
To be boiled in Boiling water for 2 hors.
%
0.0001
7
Surface Insulation Resistance
500V direct current
normal
M.Ω
≥1×10-5
const damp and hot
≥1×10-3
8
Bulk Resistance
In normal conditio
MΩ.cm
≥1×10-5
const damp and hot
≥1×10-4
9
Resistance Between Plugs
500V direct current
In normal conditio
≥1×10-6
In constant damp condition
≥1×10-4
10
Surface Electric Strength
In normal conditio
δ=1mm(kv/mm)
≥1.6
In constant damp condition
≥1.2
11
Dielectric Constant
10GHz
εr
3
(±2%)
6
9.2
9.6
10.2
12
Dielectric Constant Tangent
10GHz
tgδ
≤1×10-3